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Root Cause Analysis

Root Cause Analysis identifies the underlying causes of yield problems and offers proven solutions for improvement. This comprehensive service, exclusive to BlueRing Stencils, sets us apart from other stencil manufacturers. Leveraging decades of engineering experience and proprietary analysis software, our engineering team can diagnose and resolve SMT yield issues at any stage of the assembly process.
Root Cause Analysis
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What do we provide?

Identify the root cause of yield problems
Accurate and thorough analysis based on assembly and process variables
Detailed and comprehensive analysis reports
Significant increases in assembly yields with specific stencil design suggestions

Areas Where Yield Problems Occur:

  • PCB
  • Component footprint
  • Print
  • Pick-and-place
  • Reflow profile
  • Wave solder
  • Solder paste
  • Thermal heat sinks
  • more….

Common Defects That Affect Yields:

  • Poor paste release
  • Insufficient solder
  • Bridging at reflow
  • Tombstones
  • Component shift and skew
  • De-wetting
  • Solder balls
  • Voids
  • more…

Sample Reports

Below are sample reports which will be very similar to the one you will receive regarding your process analysis. All reports contain, the problem description, our Root Cause Analysis of the problem and our custom recommendation to solve the issue. The names have been removed to protect the identity of our clients.
Sample Report 1
Sample Report 2
Sample Report 3
Sample Report 4
Sample Report 5
RC_Sample4

Papers

Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design

Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult. This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on print capability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented on various common SMT defects.
Paper
Presentation