Step Stencil Technology

Multi-level (step) stencils from BlueRing Stencils are designed and manufactured by using various techniques to improve stencil printing. Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting the pad sizes, stepped stencils are necessary to optimally match the soldering paste volumes.

Relief areas can be precisely milled or etched into the board side of the foil for use on rework boards. The higher reworked area fits into the relief allowing the stencil to lay flat on the SMT pads. This minimizes bridging by ensuring a gasket seal between the stencil and board pads. Damage to the board and stencil is also minimized. This is an excellent solution for boards with labels and boards with filled vias.

Step up areas are created using a patented laser weld process that ensures a smooth print with no squeegee damage. Different design and layout specifications have to be taken into account in the manufacture of stepped stencils.  Please consult your BlueRing Stencil customer representative for guidance on which technology is best for your process.

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E-Z Steps Laser Welding

Micro-milled Steps

Chemical Etched Steps


Step Stencil Technologies and Their Effect on the SMT Printing Process

It is a common fact that the print process is one of the most critical elements in SMT production and many of today’s assemblies include both miniature components such as 0201’s, Micro-BGA’s, LGA’s and QFN’s as well as large components such as large connectors on the same assembly. Printing the proper volume of paste on these assemblies is not always possible by adjusting the apertures on single level stencils. As a result, manufacturers are finding that “Step Stencils” allow them to apply the correct amount of paste to different components on the same assembly with excellent first pass yields.