The NanoSlic® stencil is the most advanced solder paste stencil available today. The coating was developed by Florida CirTech chemists to achieve a durable, paste repelling coating that improves stencil printing significantly. Building on the proven benefits of the Slic™ stencil, advanced chemistry is used to impart a highly Hydrophobic & Oleophobic surface to the apertures and underside of the stencil. This non-stick surface resists solder paste build-up, significantly reducing the need for cleaning cycles. The Nano coating is permanently bonded to and conforms to aperture walls regardless of size or geometry. The NanoSlic® stencil improves paste release, enabling high yield printing at low area SARs (surface area ratios). NanoSlic® has a robust surface that stands up to repeated cleaning.
Frequently Asked Questions
Can Nano-Coatings Really Improve Stencil Performance?
This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings. Criterion such as underside cleaning, bridging, transfer efficiency across SARs, solder paste deposit geometry, post-print cleaning, and abrasion resistance of the coating, will all be considered and weighted. Performance of currently available coatings will be compared. A discussion of the economic impact on current and future SMT design will be included.
Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design
Nano-coatings are applied to solder paste stencils with the intent of improving the solder paste printing process. Do they really make a noticeable improvement? The effect of Nano-coatings on solder paste print performance was investigated. Transfer efficiency was studied across aperture sizes ranging from 0.30 to 0.80 area ratio. Also investigated were the effects of Nano-coatings on transfer efficiency of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano-coating was summarized with respect to all of these variables.
An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios
This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs. The aperture area ratios studied range from 1.06 down to 0.30. The effects of nano-coatings are studied and compared to un-coated laser cut, fine grain steel stencils.
An Investigation into the Durability of Stencil Coating Technologies
It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide, there is also a cost. As PWB assemblers work to justify the return on investment, one key question continues to arise. What is the durability or life of these coatings and what can be done in the print process to maximize the life of the coatings? This paper addresses durability of the coatings in relation to the number of print cycles and underside wipe cycles applied as well as materials used on the underside wipe process. Different parameters will be applied and data will be collected. The results of this study will be summarized to help those using or considering the use of these nano coatings to improve their print process and suggestions will be given to maximize the life of the coatings.