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NanoSlic® Gold Stencil


Introducing the NEW Patent Pending Surface Modification Process
BRS is the exclusive licensee in the U.S. and Canada of the Most Popular and Proven Coated Stencil in the market.

The NanoSlic chemistry was not bought, it was built from the surface up. We worked closely with industry partners to develop a top-of-the-line stencil coating. Through the use of our SMT testing lab, we were able to simulate a high production assembly environment to push the limits of NanoSlic Gold. Our lab allows us to continue research and development of new coating technologies that adapt to our customers’ rapidly evolving processes. 

The NanoSlic® Gold stencil is the most advanced solder paste stencil available today. The coating was developed by Florida CirTech chemists to achieve a durable, paste repelling coating that improves stencil printing significantly. Building on the proven benefits of the Slic™ stencil, advanced chemistry is used to impart a highly Hydrophobic & Oleophobic surface to the apertures and underside of the stencil. This non-stick surface resists solder paste build-up, significantly reducing the need for cleaning cycles. The Nano coating is bonded to and conforms to aperture walls regardless of size or geometry. The NanoSlic® Gold stencil improves paste release, enabling high yield printing at low SARs (surface area ratios). NanoSlic® Gold has a robust surface that stands up to repeated cleaning.

NanoSlic Gold Stencil

Introducing the NEW Patent Pending Surface Modification Process

Next-Gen NSG

Rolling out to our facilities nationwide this year

Our continued research and development of NanoSlic Gold led to a breakthrough in durability and longevity characteristics. NanoSlic Gold Stencils will now be manufactured using a New Patent Pending Surface Modification Process which offers our industry-leading surface and aperture functions with extended coating durability.

10x Coating Durability
Same Name…
Same Price…

Industry Leading
Transfer Efficiency at
Low Area Ratios

Always Decreases
Coefficient of Variation
in Your Print Process

Surface Functions

Reduced Underside Cleaning
Reduced Underside Cleaning
Improved Solder Brick Profiles
Improved Solder Brick Profiles
Reduced Bridging
Reduced Bridging

Aperture Functions

Improved Paste Release
Improved Paste Release
Transfer Efficiency Increase
Transfer Efficiency Increase
ItemCost Savings ($)
Improved print cycle time2 boards per minute instead of 1
CleaningSave $0.15 - .20 per print
Less waste of solder pasteSave $0.04 - 0.07 per print
Yield improvementSavings inestimable
Save on rework costsEliminate rework and cycle time improves
Save materials and labor cost for rework
NanoSlicROI is 270 to 400 prints

Frequently Asked Questions


Can Nano-Coatings Really Improve Stencil Performance?

This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings. Criterion such as underside cleaning, bridging, transfer efficiency across SARs, solder paste deposit geometry, post-print cleaning, and abrasion resistance of the coating, will all be considered and weighted. Performance of currently available coatings will be compared. A discussion of the economic impact on current and future SMT design will be included.

NanoSlic Gold Stencil

Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design

Nano-coatings are applied to solder paste stencils with the intent of improving the solder paste printing process. Do they really make a noticeable improvement? The effect of Nano-coatings on solder paste print performance was investigated. Transfer efficiency was studied across aperture sizes ranging from 0.30 to 0.80 area ratio. Also investigated were the effects of Nano-coatings on transfer efficiency of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano-coating was summarized with respect to all of these variables.

NanoSlic Gold Stencil

An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios

This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs. The aperture area ratios studied range from 1.06 down to 0.30. The effects of nano-coatings are studied and compared to un-coated laser cut, fine grain steel stencils.

NanoSlic Gold Stencil

An Investigation into the Durability of Stencil Coating Technologies

It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide, there is also a cost. As PWB assemblers work to justify the return on investment, one key question continues to arise. What is the durability or life of these coatings and what can be done in the print process to maximize the life of the coatings? This paper addresses durability of the coatings in relation to the number of print cycles and underside wipe cycles applied as well as materials used on the underside wipe process. Different parameters will be applied and data will be collected. The results of this study will be summarized to help those using or considering the use of these nano coatings to improve their print process and suggestions will be given to maximize the life of the coatings.

NanoSlic Gold Stencil


NanoSlic Gold Coated Stencils

IPC APEX Expo 2016

IPC APEX Expo 2014