Rework Stencils
BlueRing Stencils specializes in manufacturing rework stencils designed for precise solder paste deposits during component rework or replacement. These stencils enable production engineers to address and reprint specific problem areas without disrupting the entire board’s integrity. Available for all component types, our rework stencils are meticulously laser-cut to match production stencils.
Our rework stencils are engineered for superior stability, minimizing paste smearing and ensuring consistent performance. Contact BlueRing Stencils for reliable solutions that uphold the highest standards of quality and precision in electronic assembly.
Prototype
Our frameless solder paste stencils are expertly crafted for manual printing, offering precise control tailored for smaller production runs. Ideal for situations requiring exact amounts of solder paste, our Foil or Plate Only stencils ensure accuracy and ease of use.
Customized to fit your specific needs, these stencils enable precise hand printing while offering convenient storage solutions. Choose BlueRing Stencils for reliable, high-quality tools designed to enhance your manufacturing processes with efficiency and accuracy.
Rework
These stencils are particularly effective for applications involving larger components with ample clearance around the pads. The solder paste is evenly applied by squeegeeing it across the stencil, after which the assembly is gently flipped forward to lift the stencil off the board. Subsequently, the component is positioned and undergoes reflow at the board level, ensuring precise and reliable assembly.
Component Print
With our custom stencil and holding fixture, solder paste can be efficiently applied to component leads. The part fits snugly into a recessed area on the stencil’s bottom, securing it in place while paste is applied to the top side.
After removing the part, it’s positioned onto the SMT pads and undergoes reflow at the board level, ensuring precise and reliable assembly.
BGA Reballing
BlueRing Stencils offers custom BGA re-balling stencils designed for efficiently replacing solder balls on components.
By using our reballing stencils, you can accurately reapply the balls to the component, followed by a seamless reflow process. This ensures the component is ready for reattachment to the PCB, effectively salvaging valuable components.