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Learn Something New! Register for Quarantech Tuesday

Keep up with industry trends by registering for our technical webinar series, Quarantech Tuesday! The webinar episodes, co-hosted by BlueRing Stencils and FCT Solder have SMT Experts on the show to share their knowledge and answer any questions you may have in real-time. Tune in every other week as we discuss common assembly defects, yield issues, and simple solutions to enhance every assembly process. 

Learn something new! Register for the next Quarantech Tuesday!
WHERE: Zoom
WHEN: January 19, 2021
TIME: 2:00 PM EST
TOPIC: Maximizing Deionized Water Efficiency in the Electronics Assembly Process
SIGN UP - SPACE IS LIMITED!
Simplify your DI treatment system. Learn what to look out for, how this applies to the electronics assembly process and the importance of quality deionized water. Figure out how to troubleshoot issues and optimize system design to maximize throughput. Demystify the DI setup and decision process with FCT Water Certified Water Technologist.
 
Look for more information about future topics, including:

 –  Unique printing technologies
 – High-reliability alloys
 –  Tooling and fixture advancements
 –  …and MORE!!!

 

Start off the New Year with Quarantech Tuesday

Keep up with industry trends by registering for our technical webinar series, Quarantech Tuesday! The webinar episodes, co-hosted by BlueRing Stencils and FCT Solder have SMT Experts on the show to share their knowledge and answer any questions you may have in real-time. Tune in every other week as we discuss common assembly defects, yield issues, and simple solutions to enhance every assembly process. 

Kick off 2021 learning something new. Register for the next Quarantech Tuesday!
WHERE: Zoom
WHEN: January 5, 2021
TIME: 2:00 PM EST
TOPIC: Solder Joint Reliability – The Effects of Solder Paste Volume on Reliability
SIGN UP - SPACE IS LIMITED!
Printing of solder paste and stencil technology has been well studied and many papers have been presented on the topic. However, very few studies have looked at how solder paste volume affects solder joint reliability. It is the aim of this work, by FCT Solder FAE Tony Lentz, to correlate printed solder paste volume to solder joint reliability.
 
Look for more information about future topics, including:

 –  Unique printing technologies
 – High-reliability alloys
 –  Tooling and fixture advancements
 –  …and MORE!!!

 

Keep Up with Industry Trends! Register for Quarantech Tuesdays

Keep up with industry trends by registering for our technical webinar series, Quarantech Tuesday! The webinar episodes, co-hosted by BlueRing Stencils and FCT Solder have SMT Experts on the show to share their knowledge and answer any questions you may have in real-time. Tune in every other week as we discuss common assembly defects, yield issues, and simple solutions to enhance every assembly process. 

Don’t miss out on the second webinar!
WHERE: Zoom
WHEN: October 20, 2020
TIME: 2:00 PM EST
TOPIC: Root Cause Workshop – Stencil Design for SMT Component Thermal Lands
SIGN UP - SPACE IS LIMITED!
Join us as BlueRing Stencils’ Greg Smith and Tony Lentz from FCT Solder discuss their paper, originally presented at SMTAI.
 
ABSTRACT Recent studies on stencil design to minimize voiding on quad flat no lead (QFN) thermal lands suggest higher paste volumes create lower voiding percentages. However, volume must be reduced to eliminate the possibility of float during reflow. Thermal land stencil designs on components other than QFN’s must also reflect a reduction in printed volume to eliminate float while minimizing void percentages. The IPC 7525B Stencil Design Guideline [1] recommends a 20% to 50% reduction in the printed area of the thermal/ground plane for leadless chip carrier (LCC) / bottom terminated component (BTC) devices which is a very broad window. This guideline also recommends the window pane design for printing these thermal lands but does not specify the size of the gaps between panes. It also does not specify how close these panes can be printed to the edge of the thermal land without creating shorts to the perimeter leads or creating solder balls on components such as Decawat Packages (D-Pak). This window pane stencil design remains the most used design for the reduction of paste on thermal pads as many other designs such as rounds, diamonds, diagonal pads etc. have not been shown to dramatically impact voiding percentages. This paper specifically explores the effect of the window pane design on void area percentage after reflow for surface mount technology (SMT) component thermal pads without introducing float to the component. Specific window pane gap sizes, total area printed and distance of the outer pane edges to the copper thermal land edge will be varied to determine guidelines for thermal pad stencil design.
 

LEARN MORE ABOUT OUR PRESENTERS:

Find Tony Lentz on LinkedIn
Find Greg Smith on LinkedIn 

Look for more information about future topics, including:

 –  Unique printing technologies
 –  High reliability alloys
 –  Tooling and fixture advancements
 –  …and MORE!!!

Get the next webinar on your calendar!

Take Advantage of Design Versatility & Cut Costs with Laser Depaneling on November 3rd

PRE-REGISTER TODAY

Reliability Matters: A Podcast Discussing Reliability of Circuit Assemblies

Listen to “Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction” on Spreaker.

Tune in to Episode 32 of Mike Konrad’s podcast Reliability Matters! FCT Assembly Field Application Engineer, Tony Lentz, and BlueRing Stencils Manager of Stencil Technology, Greg Smith, were recently featured as special guests on this podcast which focuses on the Reliability of Circuit Assemblies.

As stated in the title, Mike Konrad airs A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled “Root Cause Stencil Design for SMT Component Thermal Lands”. 

Reliability Matters: A Podcast Discussing Reliability of Circuit Assemblies

Greg was the owner and President of a stencil manufacturing company for 23 years prior to joining FineLine Stencil (FLS). Since the merger of FLS and MET, Greg has been utilizing his decades of experience to help customers. He writes and presents white papers, works with customers on stencil design and performs root cause analysis to improve customer yields.

Tony has extensive experience doing research and development, quality control, and technical services with products used to manufacture and assemble printed circuit boards. He has published and presented many papers at industry events and is a Speaker of Distinction with SMTA.

Listen to this informative podcast to find out what strategies Greg and Tony suggest in order to alleviate problems in electronics assembly. Learn more about low-voiding solder pastes, stencil design, best practices, and other practical approaches to void reduction. Low-voiding solder paste is a great place to start when experiencing voiding issues, but there are numerous other factors to take into consideration as well.

Greg and Tony are happy to share their expertise! For more information on this topic, reach out to our industry experts!

Tony Lentz can be reached here: [email protected]

Greg Smith can be reached here: [email protected]

BlueRing Stencils and Stone Mountain Tool Agree to Acquisition

BlueRing Stencils and Stone Mountain Tool Agree to Acquisition

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Lumberton, NJ – BlueRing Stencils is excited to announce the acquisition of Stone Mountain Tool. Stone Mountain Tool is recognized as an industry leader with over 35 years’ experience of supplying tooling for electronic manufacturers. BlueRing Stencils is excited for the opportunity to provide customers with a wide range of tooling products such as wave solder pallets, conformal coating fixtures, surface mount carriers, and much more. By combining laser and machining technologies, along with world-class design and engineering teams, BlueRing Stencils now offers more high-quality solutions at various steps of the electronic assembly process.

Fred Cox, BlueRing Stencils President says, “I am pleased to announce that Stone Mountain Tool is now part of BlueRing Stencils. This addition will bring access to tooling for pallets, fixtures and other machined parts to all BRS customers. Stone Mountain Tool has a strong reputation for technology and high quality in the SMT tooling field. These qualities are a perfect match for the BRS “way.” We are excited to be able to fill this need in the industry.”

David Duke, Stone Mountain Tool President says, “We’re excited to become part of BlueRing Stencils. Their commitment to customer service and quality seamlessly complements the mission of Stone Mountain Tool.”

BlueRing Stencils is always committed to improvement and growth! Check out their News & Events page (https://blueringstencils.com/news-events/) to discover their influence in the industry. They strive to bring better products with greater value to their customers. Be on the lookout for updates from BlueRing Stencils.

Read the Press Release