Improve SMT Assembly Yields Through Stencil Design
Greg Smith was recently featured on the Quarantech Tuesday webinar series to discuss improving yields. Reducing first-pass defects in the SMT assembly process starts at the beginning with SMT stencil design and the solder print process. Correct stencil design from the start will minimize cost, assembly time and improve product reliability. This presentation highlights general stencil design guidelines and looks at solving defects with stencil aperture changes. Defects such as insufficient solder, solder balls, tombstoning, bridging, head-in-pillow, and voiding will all be discussed as they relate to stencil design, and practical stencil design recommendations are made.