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Precision Defines Us

At BlueRing Stencils, we are industry leaders in manufacturing solder stencils for the PCB Assembly market. Our engineering and design team possesses extensive expertise in the surface mount assembly process, from printing to reflow. By focusing on a comprehensive understanding of the entire process, we design our circuit board stencils to enhance key metrics in PCB assembly.

BlueRing Stencils is at the cutting edge of technology and committed to continuous improvement and innovation. Our advanced fiber laser cutting systems produce highly precise SMT stencils, and our NanoSlic Gold nano-coating technology ensures we deliver the most advanced solder stencils in the industry.

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PCB Solder Stencils Specialized for High Yield Production

SMT Stencil Loaded to Printer

Advanced SMT Laboratory

BlueRing Stencils boasts a state-of-the-art SMT Laboratory, equipped with SPI, Pick and Place, Reflow, and X-Ray capabilities—setting us apart from any other stencil company in the United States. This unique facility allows us to continuously enhance our technology and processes. Our groundbreaking stencil coating technologies, NanoSlic and MicroShield, are the results of a collaboration between our SMT Laboratory and Polymer Chemists. These innovations enable precise printing for the latest ultra-small component apertures.

We’re engineers at ♥

Tech Tuesday: NanoSlic Gold Long Life Research Project

NanoSlic® Gold: Engineered to Last

In our continued research and development of NanoSlic Gold (NSG), we explored numerous methods for increasing stencil longevity and transfer efficiency, including popular methods like Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) 

In the end, however, we discovered a method that increased stencil longevity by as much as ten times, without sacrificing transfer efficiency: Laser Direct Structuring (LDS).

NanoSlic® Gold Solder Stencil Coating

Exclusive U.S. & Canadian Licensee of NanoSlic® Gold

BRS proudly holds the exclusive license for NanoSlic® Gold in the U.S. and Canada, the market’s leading coated stencil technology. Unlike other products, NanoSlic was meticulously engineered from the surface up in collaboration with industry partners. Our state-of-the-art SMT testing lab simulates high-production assembly environments, enabling us to rigorously test and refine NanoSlic Gold. This facility also supports ongoing R&D to innovate new coating technologies that meet the evolving needs of our customers.

NanoSlic Gold’s advanced coating enhances stencil performance by improving both surface and aperture functions. Its hydrophobic and oleophobic properties ensure that solder paste does not adhere to the stencil’s underside, even with imperfect gaskets during the stencil printing process. This unique capability leads to cleaner prints and higher transfer efficiency in production.

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nsg substrate

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