Root Cause Stencil Design for SMT Thermal Component Lands
This paper, written by Greg Smith, BRS Manager of Stencil Technology, specifically explores the effect of the window pane design on void percentage after reflow for SMT component thermal pads without creating float and skew.
PCB Solder Stencils Specialized for High Volume Production
Our Business is Solder Stencils
BlueRing Stencils manufactures PCB solder stencils for the PCB Assembly market. Our design and assembly team has a deep understanding of the surface mount assembly process from print thru reflow. BlueRing Stencils focuses our efforts and engineering staff on better understanding the entire process and designs our circuit board stencils to improve customer’s yields.
BlueRing Stencils is committed to improving technology in our market. Our advanced, state-of-the-art fiber laser cutting systems are used to produce precise SMT stencils and our NanoSlic Gold nano coating technology allows us to provide our customers with the most advanced solder stencils in the industry.
We’re engineers at ♥
BlueRing Stencils operates a full SMT Laboratory, with SPI, Pick and Place, Reflow and X-Ray unlike any other stencil company in the United States. This distinguishing characteristic provides the ability to continuously improve both our technology and processes. NanoSlic and MicroShield, our industry changing stencil coating technologies, are both results of collaboration between our SMT Laboratory and our Polymer Chemists to develop stencil coating technologies able to print the latest ultra-small component apertures.
NanoSlic® Gold Solder Stencil Coating
The NanoSlic Gold coating technology improves stencils from both a surface function and an aperture function. The most important aspect of the coating is that it’s both Hydrophobic and Oleophobic, which means the coating repels both water based chemistry and oil based chemistry. The result is that solder paste does not stick to the underside of the stencil even if the gasket is not perfect during the stencil print process.
In addition, underside cleaning can be decreased on the stencil printer and bridging is greatly reduced or eliminated, all while improving solder paste release from the apertures and increased transfer efficiency. In many cases, customers see an increase of 10-25% in transfer efficiency on small apertures. Also on most jobs, customers can eliminate the need for step stencils as the coating allows lower area ratios to be printed on the same foil thickness.